Brief description of the process
Before manufacturing semiconductors, silicon must be converted into wafers. Wafer production includes: rod growth, wafer cutting and detection, outer diameter grinding, slicing, edge grinding, surface grinding, etching, defect removal, polishing, cleaning and packaging inspection. After grinding, a large amount of ultra pure water is used to clean the suspended particles or metal ion pollutants on the surface of the wafer CMP grinding waste liquid and cleaning waste water are produced.
Improper treatment or direct discharge of wastewater will pollute the environment
The treatment water is not recycled, resulting in waste of water resources
Large amount of sludge and unstable water quality
The overflow water is further filtered by the middle water pump after being pressurized to 10 microns Bag filter 1 micron Filter element filter After that, the activated carbon adsorption device and the 0.2 micron precision filter at the terminal enter into the terminal water tank. The reclaimed water completely treated by the system is sent to the ultrafiltration water production tank by the end water supply pump, which can be directly fed into the reverse osmosis device to continue to produce ultra pure water. The ceramic membrane microfiltration device can also be used to filter and concentrate the supernatant in the above process.